製程能力

正紅科技製程能力
Layers Count (Min-Max)層數 2—16Layers
Warp & Twist板彎板翹 0.75%
Panel Size（尺寸）panel 尺寸 MAX. 22*28"
Double Sided雙面板 Copper Foil thickness芯板銅箔厚度 0.5/1/2oz
Minimum Core Thickness 4mils
Multilayers Board多層板層） Copper Foil Thickness (Inner Layers)芯板銅箔厚度（內層） 0.5/1/2oz
Copper Foil Thickness (Outer Layers)銅箔厚度（外層） 1/3 1/2 1 2 oz 15umoz/um
Minimum Core Thickness最小芯板厚度 4mils
Minimum B-stage Thickness最小PP厚度 2.8mils
Board Thickness材料厚度 Minimum Board Thickness (Double-Sided)最小板厚（雙面板） 0.1mm
Board Thickness材料厚度 Minimum Board Thickness (Multilayers Board)最小板厚（多層板） 0.3mm
Maximum Board Thickness (Double-Sided)最大板厚（雙面板） 3.2mm
Maximum Board Thickness (Multilayers Board)最大板厚（多層板） 3.2mm
Minimum Via Diameter (Drill bit size)最小過孔直徑（鑽嘴尺寸） 0.2mm
MechanicalDrill(Through-holes)鑽孔(通孔）—機械鑽孔度 Minimum Via Diameter (After Plating)最小過孔直徑（鍍銅後） 0.2mm
Through holes過孔 Minimum hole wall Cu thickness最小孔銅厚度 FR-40.7
Maximum aspect ratio最大板厚比最小孔徑(縱橫比) FR-4≦8:1
Electroless Nickel / Immersion Gold化鎳/金 Minimum / Maximum Nickel thickness最小/大鎳厚 100/200u"
Minimum / Maximum Gold thickness最小／大金厚 1/3u"
Immersion Silver (over copper)化銀 Minimum / Maximum Silver thickness最小／大銀厚 6/15u"
HAL 噴錫 Minimum / Maximum Solder thickness最小／大錫厚 30/1500 u"
OSP 抗氧化 Minimum / Maximum Coating thickness最小／大膜厚度 0.15/0.35um
Inner Layer and Outer Layer(內外層) Line width / spacing tolerance線寬/線距公差 上懸:30%,下懸:20%
Outer Layer Imaging外層成像 Artwork registration tolerance底片對位公差 +-2MIL
Solder Mask 防焊 Minimum opening path on pad (one side)防焊PAD開窗單邊(b) 2.0mils
tolerance of exposure registration曝光精準度 ±2mils
Minimum solder mask Thickness (Above Trace)最小油墨厚度（線路上） 0.3-0.8mils
Minimum solder mask strip (pass tape test)最小綠油橋（通過抗拉測試) 4mils
Legend (Silkscreen)文字 Minimum height & width of legend最小文字高度與寬度 15*20mils
Minimum spacing between legends文字最小間距 3mils
Peelable Solder mask可剝膠 Min space between golden finger to soldering PAD金手指與噴錫PAD距離(A) 28mils
Peelable Solder mask可剝膠 Min designed length of peelable solder mask on golden finger(one side)蓋金手指可剝膠設計單邊長度 60-100mils
Carbon Ink碳墨 Thickness of carbon printed碳墨厚度長度 在線路上(On circuit )：0.8~2 mils在銅面上(On copper surface)：0.8~2 mils
Carbon Ink碳墨 Mini space between carbon ink pattern to PAD碳墨與PAD最小間距 10mils
Carbon Ink碳墨 Mini space between carbon ink pattern印製後碳墨圖形間距 15mils
Drilling鑽孔 accuracy of hole to hole鑽孔孔位精度 成品厚度1.6mm單片鑽孔位精度≦2.5mil 2片鑽孔位精度≦4mil Finished board thickness at 1.6mm: drilling accuracy for 1 PNL ≦2.5mil;drilling accuracy for 2PNL ≦4mil
Drilling鑽孔 Space between hole edge孔邊到孔邊距離 同一網絡(hole in same net): ≧0.15mm 不同網絡(hole in different net): ≧0.2mm
Drilling鑽孔 Mini diameter of slot holeSlot孔最小孔徑 0.5mm
tolerance of PTH hole sizePTH孔公差 ±0.05mm
Routing 成型 Mini space between routing edge to copper surface成型邊到銅面的間距 8mils
length & width of routing slot(tolerance)成型槽長寬公差 ±4mil
Vee-cut V-cut Vee-cut anglesV-CUT 角度 30 / 45 / 60Degree
Min space between Vee-cut edge to Vee-cut edgeV-CUT到V-CUT的最小距離 ＞3mm
Min space between V-cut edge to board edgeV-CUT到板邊的最小距離 ＞3mm
Minimum / Maximum board thickness最小/最大板厚 0.8-3.2mm
Gold Finger beveling 金手指 Beveling angle斜邊角度 20~45Degree
Tolerance of beveling depth斜邊深度公差 ±5mil
Electrical testing 電測 Min width of test PAD測試PAD最小寬度 Specific tester： 9 mil Current tester：9mil Flying probe： 3mil
Max size of board可測試最大板尺寸 Specific tester： 30*50--400* 500 mm Current tester：30*50--300*400mm Flying probe：30*50--500*600mm
Minimum board thickness可測試的最小板厚 0.2mm
Maximum board thickness可測試的最大板厚 3.2mm
Number of test points測試點的數量 Specific tester：16384 點 Current tester：73728 點 Flying probe：without limiting
Control Impedance 阻抗控制 tolerance公差 ± 10%(40-60ohm) ± 15%(40ohm or below)
Space between probes測針間距 2.54mm
Artwork底片—Inner layer (Signal layer) 內層 Line width線寬 4mils
space between circuits線距 3mils
Artwork底片—Outer layer 外層 Min line width最小線寬 4mils
space between circuits最小線距 3mils
space between BGA PAD to circuitBGA焊盤到線的間距 ≧4mils

製程能力