檢驗標準
| 正紅科技检验标准 |
| 阶段 |
检验项目 |
仪器 |
检验方法 |
| material原材料 |
peel strength(copper foil铜箔拉力测试 |
peeling measure meter拉力测试仪 |
IPC－TM－650 2.4.2 |
| Resin flowPP流动度 |
resin flowing meter树脂流动度测试仪 |
IPC－TM－6502.3.17 |
| Resin contentPP胶含量 |
resin content meter树脂流动度测试仪 |
IPC－TM－650 2.3.16.1 |
| gelatin timePP凝胶时间 |
gelatin machine凝胶时间测试机 |
IPC－TM－650 2.3.18 |
| process过程 |
TG |
DSC |
IPC－TM－650 2.4.25 |
| Back light背光 |
measure microscope
测量显微镜 |
not standard 非标 |
| impedance阻抗 |
TDR阻抗测试仪 |
IPC－TM－650 2.5.5.7 |
| conductance of DI water电导率 |
conductance meter电导率仪 |
not standard 非标 |
| peel strength(plated copper)镀层附着力 |
810＃3Madhesive tape810＃3M胶带 |
IPC－TM－650 2.4.1 |
| peel strength(solder mask)油墨附着力 |
810＃3M adhesive tape,withstand chamfering instrument810＃3M胶带，耐磨测试仪 |
IPC－TM－650 2.4.28.1
IPC－TM－650 2.4.27.1 |
| plating thickness镀层厚度测试 |
CMI copper thickness meter,x-ray thickness measure meter,measure microscopeCMI铜厚测量仪、膜厚测量仪、金相切片机 |
IPC－TM－650 2.1.1 |
| pencil hardness铅笔硬度测试 |
6H pencil6H铅笔 |
IPC－SM－840 |
| Ionic Cleanliness离子污染度 |
omega meter离子污染测试仪 |
IPC－TM－650 2.3.25 |
| finished board成品 |
solderability可焊性 |
mini tin stove(with/without Pb)小锡炉（有、无铅焊料） |
J-STD-003 |
| thermal shock热冲击 |
mini tin stove (with/without Pb) measure microscope
小锡炉（有、无铅焊料）、金相切片机、测量显微镜 |
IPC－TM－650 2.6.8 |
| Fog of salt water test盐雾实验 |
salt&fog test instrument盐雾实验测试仪 |
IPC－TM－650 |
| E-test开短路测试 |
E-test/flying probe machine电测机、飞针测试机 |
IPC-ET-652 |
| Insulation Resistance绝缘电阻测试 |
humidity test chamber Insulation Resistance instrument
恒温恒湿测试绝缘电阻测试仪 |
IPC－TM－650 2.6.3 |
| Interlinkage Resistance 导通电阻测试 |
humidity test chamber micro-ohmmeter恒温恒湿测试机、微欧姆计试仪 |
IPC－TM－650 2.6.3 |
| withstand voltage耐电压测试 |
humidity test chamber Insulation Resistance test instrument
恒温恒湿测试机、绝缘电阻测试仪 |
IPC－TM－650 2.5.7 |
