Capability
| PCB Square capibility |
| Layers Count (Min-Max) |
2—16Layers |
| Warp & Twist |
0.75% |
| Panel Size |
MAX. 22*28" |
| Double Sided |
Copper Foil thickness |
0.5/1/2oz |
| Minimum Core Thickness |
4mils |
| Multilayers Board |
Copper Foil Thickness (Inner Layers) |
0.5/1/2oz |
| Copper Foil Thickness (Outer Layers) |
1/3 1/2 1 2 oz 15umoz/um |
| Minimum Core Thickness |
4mils |
| Minimum B-stage Thickness |
2.8mils |
| Board Thickness |
Minimum Board Thickness (Double-Sided) |
0.1mm |
| Board Thickness |
Minimum Board Thickness (Multilayers Board) |
0.3mm |
| Maximum Board Thickness (Double-Sided) |
3.2mm |
| Maximum Board Thickness (Multilayers Board) |
3.2mm |
| Minimum Via Diameter (Drill bit size) |
0.2mm |
| MechanicalDrill(Through-holes) |
Minimum Via Diameter (After Plating) |
0.2mm |
| Through holes |
Minimum hole wall Cu thickness |
FR-40.7 |
| Maximum aspect ratio |
FR-4≦8:1 |
| Electroless Nickel / Immersion Gold |
Minimum / Maximum Nickel thickness |
100/200u" |
| Minimum / Maximum Gold thickness |
1/3u" |
| Immersion Silver (over copper) |
Minimum / Maximum Silver thickness |
6/15u" |
| HAL |
Minimum / Maximum Solder thickness |
30/1500 u" |
| OSP |
Minimum / Maximum Coating thickness |
0.15/0.35um |
| Inner Layer and Outer Layer |
Line width / spacing tolerance |
Upper hanging:30%,lower hanging:20% |
| Outer Layer Imaging |
Artwork registration tolerance |
+-2MIL |
| Solder Mask |
Minimum opening path on pad (one side) |
2.0mils |
| tolerance of exposure registration |
±2mils |
| Minimum solder mask Thickness (Above Trace) |
0.3-0.8mils |
| Minimum solder mask strip (pass tape test) |
4mils |
| Legend (Silkscreen) |
Minimum height & width of legend |
15*20mils |
| Minimum spacing between legends |
3mils |
| Peelable Solder mask |
Min space between golden finger to soldering |
28mils |
| Peelable Solder mask |
Min designed length of peelable solder mask on golden finger(one side) |
60-100mils |
| Carbon Ink |
Thickness of carbon printed |
(On circuit )：0.8~2 mils(On copper surface)：0.8~2 mils |
| Carbon Ink |
Mini space between carbon ink pattern to PAD |
10mils |
| Carbon Ink |
Mini space between carbon ink pattern |
15mils |
| Drilling |
accuracy of hole to hole |
Finished board thickness at 1.6mm: drilling accuracy for 1 PNL ≦2.5mil;drilling accuracy for 2PNL ≦4mil |
| Drilling |
Space between hole edge |
(hole in same net): ≧0.15mm
(hole in different net): ≧0.2mm |
| Drilling |
Mini diameter of slot holeSlot |
0.5mm |
| tolerance of PTH hole sizePTH |
±0.05mm |
| Routing |
Mini space between routing edge to copper surface |
8mils |
| length & width of routing slot(tolerance) |
±4mil |
| Vee-cut V-cut |
Vee-cut angles |
30 / 45 / 60Degree |
| Min space between Vee-cut edge to Vee-cut edge |
＞3mm |
| Min space between V-cut edge to board edgeV-CUT |
＞3mm |
| Minimum / Maximum board thickness |
0.8-3.2mm |
| Gold Finger beveling |
Beveling angle |
20~45Degree |
| Tolerance of beveling depth |
±5mil |
| Electrical testing |
Min width of test PAD |
Specific tester： 9 mil
Current tester：9mil
Flying probe： 3mil |
| Max size of board |
Specific tester： 30*50--400* 500 mm Current tester：30*50--300*400mm
Flying probe：30*50--500*600mm |
| Minimum board thickness |
0.2mm |
| Maximum board thickness |
3.2mm |
| Number of test points |
Specific tester：16384 point
Current tester：73728 point
Flying probe：without limiting |
| Control Impedance |
tolerance |
± 10%(40-60ohm)
± 15%(40ohm or below) |
| Space between probes |
2.54mm |
| Artwork底片—Inner layer (Signal layer) |
Line width |
4mils |
| space between circuits |
3mils |
| Artwork—Outer layer |
Min line width |
4mils |
| space between circuits |
3mils |
| space between BGA PAD to circuit |
≧4mils |
